Publications

2024

   CCB Chang, CR Kao, “Phase Equilibria Related to NiGa5 in the Binary Ni-Ga System,”Materials, 17, 883, 2024.

2023

   H Tatsumi, CR Kao, H Nishikawa, “Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations,”Scientific Reports, 13, 23030, 2023.

   HT Hung, FL Chang, CH Tsai, CY Liao, CR Kao, “Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate,”Materials, 16, 6263, 2023.

   PS Shih, CH Huang, CR Kao, “Additive-induced crystallization of highly (111) textured Cu nanotwins by electroless deposition,”Journal of Alloys and Compounds, 958, 170531, 2023.

   FL Chang, YH Lin, HT Hung, CW Kao, CR Kao, “Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling,”Materials, 16 (9), 3290, 2023.

   SJ Gräfner, JH Huang, V Renganathan, PY Kung, PY Wu, CR Kao, “Fluidic-chemical characteristics of electroless copper deposition of ordered mass-fabricated pillars in a microchannel for chip packaging applications,”Chemical Engineering Science, 269, 118474, 2023.

2022

   PY Kung, WL Huang, CL Kao, YS Lin, YC Hung, CR Kao, “Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration,”Materials, 15(21), 7783, 2022.

   R Balaji, V Renganathan, CP Chu, YC Liao, CR Kao, SM Chen, “Periodic copper microbead array on silver layer for dual mode detection of glyphosate,”OpenNano, 8, 100105, 2022.

   S. J. Grafner, P. Y. Wu, and C. R. Kao*, “Flow in a Microchannel Filled with Arrays of Numerous Pillars,”International Journal of Heat and Fluid Flow, 97, 109045, 2022.

   Wei-Chen Huang, Chin-Hao Tsai, Pei Tzu, Lee, and C. R. Kao*, “Effects of Bonding Pressures on Microstructure and Mechanical Properties of Silver–Tin Alloy Powders Synthesized by Ball Milling for High-Power Electronics Packaging,”Journal of Materials Research and Technology, 19, p.3828-3841, 2022.

   Hiroaki Tatsumi, C. R. Kao, and Hiroshi Nishikawa, “Solid-State Bonding Behavior between Surface-Nanostructured Cu and Au: A Molecular Dynamics Simulation,”Scientific Reports, 12, 12755, 2022.

   Pei-Tzu Lee, Wan Zhen Hsieh, Cheng-Yu Lee, Shao Chin Tseng, Mau-Tsu Tang, Ching-Yu Chiang, C. R. Kao, and Cheng-En Ho, “Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech Structure,” Scripta Materialia, 214, 114682, 2022.

   Chen-Wei Kao, Po-Yu Kung, Chih-Chia Chang, Wei-Chen Huang, Fu-Ling Chang, C. R. Kao*, “Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps,” Materials, 15, 4297, 2022.

   J. H. Huang, P.S. Shih , V. Renganathan , S. J. Grӓfner, Y.A. Chen, C.H. Huang , C. L. Kao, Y. S. Lin, Y.C. Hung, and C.R. Kao∗, “Development of High Copper Concentration, Low Operating Temperature, and Environmentally Friendly Electroless Copper Plating Using a Copper‐Glycerin Complex Solution,” Electrochimica Acta, 425, 140710, 2022.

   Chin-Hao Tsai, Han-Tang Hung, Fu-Ling Chang, Steffen Bickel, Maik Müller, Iuliana Panchenko, Karlheinz Bock, and C. R. Kao*, “Low-temperature Transient Liquid Phase Bonding via Electroplated Sn/In-Sn Metallization,” Journal of Materials Research and Technology, 19, p.2510-2515, 2022.

   Chin-Hao Tsai, Wei-Chen Huang, and C. R. Kao*, “Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-power Semiconductor Devices,” Materials, 15, 1397, 2022.

   S. Maheshwaran, V. Renganathan, Shen-Ming Chen*, R. Balaji, C. R. Kao*, N. Chandrasekar, S. Ethiraj, M. S. Samuel, M. Govarthanan, “Hydrothermally Constructed AgWO4-rGO Nanocomposites as an Electrode Enhancer for Ultrasensitive Electrochemical Detection of Hazardous Herbicide Crisquat,” Chemosphere, 299, 134434, 2022.

   V. Renganathan, R. Balaji, S. M. Chen, N. Chandrasekar, S. Maheshwaran, and C. R. Kao, “Bifunctional nanocomposites based on SiO2/NiS2 combination for electrochemical sensing and environmental catalysis,” Electroanalysis, 34, p.111-121, 2022.

2021

   P. Y. Wu, O. Pironneau, P. S. Shih, and C. R. Kao*, “Numerical Analysis of an Electroless Plating Problem in Gas-Liquid Two Phase Flow,” Fluids, 6, 371, 2021.

   Chin-Hao Tsai, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, Jiahui Li, Hiroshi Nishikawa, and C. R. Kao*, “Low-Pressure Micro-Silver Sintering with the Addition of Indium for High-Temperature Power Chips Attachment,” Journal of Materials Research and Technology, 15, pp.4541-4553, 2021.

   Z. X. Zhu, V. Renganathan, and C. R. Kao*, “Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications,” Journal of Electronic Materials, 50, pp.6590-6596, 2021.

   Chin-Hao Tsai, Sze-Yin Lin, Pei-Tzu Lee, and C. R. Kao*, “A New Spalling Mechanism of Intermetallics from the Adhesion Layer in the Terminal-Stage Reaction Between Cu and Sn,” Intermetallics, 138, 10732, 2021.

   H. T. Hung, Z. D. Ma, P. S. Shih, J. H. Huang, L. Y. Kao, C. Y. Yang, V. Renganathan1, C. L. Kao, Y. C. Hung, and C. R. Kao*, “Highly Uniform Microfluidic Electroless Interconnections for Chip Stacking Applications,” Electrochimica Acta, 376, 138032, 2021.

   Pei-Tzu Lee, Wan-Zhen Hsieh, Cheng-Yu Lee, Yu-Hsuan Huang, Ching-Yu Chiang, Ching-Shun Ku, C. R. Kao, and Cheng-En Ho, “Synchrotron White Laue Nanodiffraction Study on the Allotropic Phase Transformation between Hexagonal and Monoclinic Cu6Sn5,” Journal of Materials Research and Technology, 13, p.1316-1322, 2021.

   S. Maheshwaran, E. Balaji, S. M. Chen, R. Biswadeep, V. Renganathan, C. Narendhar, and C. R. Kao, “Copper Sulfide Nano-globules Reinforced Electrodes for High-performance Electrochemical Determination of Toxic Pollutant Hydroquinone,” New Journal of Chemistry, 45, pp.3215-3223, 2021.

2020

    H. T. Hung, P. T Lee, C. H. Tsai, and C. R. Kao, “Artifact-Free Microstructures of the Cu-In Reaction by Using Cryogenic Broad Argon Beam Ion Polishing,” Journal of Materials Research and Technology, p.12946-12954, 2020.

    Y.S. Chiu, C.R. Kao*, and A. Shigetou, “Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressure,” Materials and Design, p.109065, 2020.

    I.A. Weng, H.T. Hung, W.C. Huang, C.R. Kao*, and Y.H. Chen, “Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface Finish,” Journal of Electronic Materials, p.5003-5008, 2020.

    Y. F. Lin, H. T. Hung, H. Y. Yu, C. R. Kao*, and Y. W. Wang, “Phase stabilities and interfacial reactions of the Cu–In binary systems,” Journal of Materials Science: Materials in Electronics, p.10161-10169, 2020.

    R. Sheikhi, Y. Huo, C. H. Tsai, and C. R. Kao*, “Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver–indium multilayer structure,” Journal of Materials Science: Materials in Electronics, p.8059-8071, 2020.

    M. H. Liao, P. Y. Lu, W. J. Su, S. C. Chen, H. T. Hung, and C. R. Kao*, “The Demonstration of Carbon Nanotubes (CNTs) as Flip-Chip Connections in 3-D Integrated Circuits With an Ultralow Connection Resistance,” IEEE Transactions on Electron Devices, p.2205-2207, 2020.

    H. Y. Yu, T. H. Yang, Y. S. Chiu, and C. R. Kao*, “Surface Diffusion and Interfacial Reaction in Cu/Sn/Ni Micro Pillars,” Journal of Electronic Materials, p.1-8, 2020.

2019

    H. Y. Yu, T. H. Yang, Y. S. Chiu, and C. R. Kao*, “Surface Diffusion and Interfacial Reaction in Cu/Sn/Ni Micro Pillars,” Journal of Electronic Materials, p.1-8, 2019.

    P. J. Chiang, J. Y. Wu, H. Y. Yu, and C. R. Kao*, “Creep Behaviors along Characteristic Crystal Orientations of Sn and Sn-1.8Ag by Using Nanoindentation,” JOM , 71, p.2998-3011, 2019.

    Y. W. Wang, Z. X. Zhu, W. L. Shih, and C. R. Kao*, “Abnormal Cu₃Sn Growth through Grain Boundary Penetration in Space-confined Ni-Sn-Cu Diffusion Couples,” Journal of Alloys and Compounds , 799, p.108-112, 2019.

    J. Y. Wu, Y. S. Chiu, Y. W. Wang, and C. R. Kao*, “Mechanical Characterizations of Single-crystalline (Cu, Ni)₆Sn₅ through Uniaxial Micro-compression,” Materials Science & Engineering A , 753, p.22-30, 2019.

    Y. S. Chiu, H. Y. Yu, H. T. Hung, Y.W. Wang, and C. R. Kao*, “Phase Formation and Microstructure Evolution in Cu/In/Cu Joints,” Microelectronics Reliability , 95, p.18-27, 2019.

    T. H. Yang*, C.R. Kao, and A. Shigetou, “Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface,” Scientific Reports , 9.1, p.504, 2019.

    I. A. Weng, H. T. Hung, S. Yang, C. R. Kao*, and Y. H. Chen, “Self Assembly of Reduced Au Atoms for Vertical Interconnections in Three Dimensional Integrated Circuits,” Scripta Materialia , 159, p.119-122, 2019.

    P. Y. Wu, C. R. Kao*, and T. W. H. Sheu*, “Modeling and simulation on electroless nickel plating in a microchannel,” Applied Mathematical Modelling , under review.

    T. H. Yang, H. Y. Yu,Y. W. Wang, and, C.R. Kao*, “Effects of Aspect Ratio on Microstructural Evolution of Ni/Sn/Ni Micro Joints,” Journal of Electronic Materials , 48.1, p.6-19, 2019.

    Y. W. Wang, W. L. Shih, H. T. Hung, and C. R. Kao*, “Reaction in Ni/Sn/Cu Micro Joints for Chip-Stacking Applications,” Journal of Electronic Materials , 48.1, p.25-31, 2019.

2018

    C.A.Yang, J. Wu, C. C. Lee, and C. R. Kao*, “Analyses and Design for Electrochemical Migration Suppression by Alloying Indium into Silver,” Journal of Materials Science : Materials in Electronics , 29, p.13878-13888, 2018.

    C.A.Yang, S. Yang, X. Liu, H. Nishikawa, C. R. Kao*, “Enhancement ofNano-Silver Chip Attachmentby Using Transient Liquid Phase Reaction with Indium,” Journal of Alloys and Compounds , 762, p.586-597, 2018.

    S. Yang, H. T. Hung, P. Y. Wu, Y. W. Wang, H. Nishikawa, and C. R. Kao*, “Materials Merging Mechanism of Microfluidic Electroless Interconnection Process,” Journal of The Electrochemical Society , 165, p.D273-D281, 2018.

    Y. W. Wang, T. L. Yang, J. Y. Wu, and C. R. Kao*, “Pronounced Effects of Zn Additions on Cu-Sn Microjoints for Chip-Stacking Applications,” Journal of Alloys and Compounds , 750, p.570-576, 2018.

2017

    H. W. Yang*, C. R. Kao, and A. Shigetou, “Fast Atom Beam- and Vacuum Ultraviolet-Activated Sites for Low Temperature Hybrid Integration,” Langmuir , 33, p.8413-8419, 2017.

    J. J. Yu, J. Y. Wu, L. J. Yu,H. W. Yang, and C. R. Kao*, “Micromechanical Behavior of Single-Crystalline Cu₆Sn₅ by Picoindentation,” Journal of Materials Science , 52, p.7166-7174, 2017.

    S. Yang, C. Y. Chang, Z. X. Zhu, Y. F. Lin, and C. R. Kao*, “Grain Boundary Penetration of Various Types of Ni Layer by Molten Metals,” Journal of Electronic Materials , 46, p.4147-4151, 2017.

    H. T. Hung, S. Yang, Y. B. Chen, and C. R. Kao*, “Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating,” Journal of Electronic Materials , 46, p.4321-4325, 2017.

    L. J. Yu, H. W. Yen, J. Y. Wu, J. J. Yu, and C. R. Kao*, “Micromechanical Behavior of Single Crystalline Ni₃Sn₄ in Micro Joints for Chip-Stacking Applications,” Materials Science and Engineering A , 685, p.123-130, 2017.

    H. W. Yang, J. Y. Wu, Z. X. Zhu, and C.R. Kao*, “Effects of Surface Diffusion and Reaction-induced Volume Shrinkage on Morphological Evolutions of Micro Joints,” Materials Chemistry and Physics, 191, p.13-19, 2017.

2016

    T. L. Yang,T. Aoki, K. Matsumoto, K. Toriyama,A. Horibe, H. Mori, Y. Orii, J. Y. Wu, and C. R. Kao*, “Full Intermetallic Joints for Chip Stacking by Using Thermal Gradient Bonding,” Acta Materialia, 113, p.90-97, 2016.

    P. S. Yang, P. H. Cheng, C. R. Kao, and M. J. Chen*, “Novel Self-shrinking Mask for Sub-3 nm Pattern Fabrication,” Scientific Reports, 6, 29625, 2016.

    J. H. Ke*, Y. Gao, C. R. Kao, and Y. Wang“Pattern Formation during interfacial Reaction in-between Liquid Sn and Cu Substrates – a simulation study,” Acta Materialia, 113, p.245-258, 2016.

    Z. X. Zhu, C. C. Li, L. L. Liao, C. K. Liu, and C. R. Kao*, “Au-Sn Bonding Material for the Assembly of Power Integrated Circuit Module,” Journal of Alloys and Compounds, 671, p.340-345, 2016.

2015

    C. C. Li, F. Drymiotis, L. L. Liao, H. T. Hung, J. H. Ke, C. K. Liu, C. R. Kao*, and G. J. Snyder, “Interfacial Reactions between PbTe-Based Thermoelectric Materials and Cu and Ag Bonding Materials,” Journal of Materials Chemistry C, 3, p.10590-10596, 2015.

    T. L. Yang,J. Y. Wu, C. C. Li, S. Yang, and C. R. Kao*, “Low Temperature Bonding for High Temperature Applications by using SnBi Solders,” Journal of Alloys and Compounds, 647, p.681-685, 2015.

    C. C. Li, J.H. Ke, C. A. Yang, and C. R. Kao*, “Mechanism of Volume Shrinkage during Reaction between Ni and Ag-doped Sn,” Materials Letters, 156, p.150-152, 2015.

    M. N. Bashir, A. S. M. A. Haseeb, A. Z. M. S. Rahman, M. A. Fazal, and C. R. Kao, “Reduction of Electromigration Damage in SAC305 Solder Joints by adding Ni Nanoparticles through Flux Doping,” Journal of Materials Science, 50, p.6748-6756, 2015.

    T. L. Yang,Z. X. Zhu,J. J. Yu, Y. F. Lin, and C. R. Kao*, “Interfacial Energy Effect on the Distribution of Ag₃Sn in Full Intermetallic Joints,” Advanced Engineering Materials, 17, pp.1528-1531, 2015.

    C. C. Li, F.Drymiotis, L. L. Liao, M. J. Dai, C. K. Liu, C. L. Cheng, Y. Y. Cheng, C. R. Kao* and G. J. Snyder, “Silver as a Highly Effective Bonding Layer for Lead Telluride Thermoelectric Modules Assembled by Rapid Hot-Pressing,” Energy Conversion and Management, 98, p.134-137, 2015.

    J. J. Yu, C. A. Yang, Y. F. Lin, C. H. Hsueh, and C. R. Kao “Optimal Ag Addition for the Elimination of Voids in Ni/SnAg/Ni Micro Joints for 3D IC Applications,” Journal of Alloys and Compounds, 629, p.16-21, 2015.

    T. L. Yang, J. J. Yu, C. C. Li, Y. F. Lin, and C. R. Kao, “Dominant Effects of Sn Orientation on Serrated Cathode Dissolution and Resulting Failure in Actual Solder Joints under Electromigration,” Journal of Alloys and Compounds, 627, p.281-286, 2015.

    C. Key Chung, Z. X. Zhu, and C. R. Kao, “Thermal stress of surface oxide layer on micro solder bumps during Reflow,” Journal of Electronic Materials, 44, p.744-750, 2015.

2014

    W. L. Shih, T. L. Yang, H. Y. Chuang, M. S. Kuo, and C. R. Kao, “Inhibition of Gold Embrittlement in Micro-Joints for Three-dimensional Integrated Circuits,” Journal of Electronic Materials, 43, p.4262-4265, 2014.

    J. H. Ke, A. Boyne, Y. Wang, and C. R. Kao, "Phase Field Microelasticity Model of Dislocation Climb: Methodology and Applications," Acta Materialia, 79, p.396-410, 2014.

    T. L. Yang,J. J. Yu,W. L. Shih, C. H. Hsueh, and C. R. Kao, “Effects of Silver Addition on Cu-Sn Microjoints for Chip-Stacking Applications,” Journal of Alloys and Compounds, 605, p.193-198, 2014.

    T.C. Huang, T.L. Yang, J.H. Ke, C. H. Hsueh, and C.R. Kao, “Effects of Sn Grain Orientation on Substrate Dissolution and Intermetallic Precipitation in Solder Joints under Electron Current Stressing,” Scripta Materialia, 80, p.37-40, 2014.

    C. C. Li, W. L. Shih, C. K. Chung, and C. R. Kao, “Amorphous Pd Layer as a Highly Effective Oxidation Barrier for Surface Finish of Electronic Terminals,” Corrosion Science, 83, p.419-422, 2014.

    C. C. Li, C. K. Chung, W. L. Shih, and C. R. Kao, “Volume Shrinkage Induced by Interfacial Reaction in Micro-Ni/Sn/Ni Joints,” Metallurgical and Materials Transactions A, 45A, p.2343-2346, 2014.

    T. L. Yang, K. Y. Huang, S. Yang, H. H. Hsieh, and C. R. Kao, “Growth Kinetics of Ag₃Sn in Silicon Solar Cells with a Sintered Ag Metallization Layer,” Solar Energy Materials & Solar Cells, 123, p.139-143, 2014.

2013

    Selected as Journal Cover, T. L. Yang, J. H. Ke, W. L. Shih, Y. S. Lai, and C. R. Kao, “Serrated Cathode Dissolution under High Current Density: Morphology and Root Cause,” Journal of Applied Physics, 114, 053501, 2013.

    C. C. Li, Z. X. Zhu, L. L. Liao, M. J. Dai, C. K. Liu, and C. R. Kao, “Assembly of N-type Bi₂(Te, Se)₃ Thermoelectric Modules by Low Temperature Bonding,” Science and Technology of Welding and Joining, 18, p.421-424, 2013.

    Y. J. Chen, T. L. Yang, J. J. Yu, C. L. Kao, and C. R. Kao, “Gold and Palladium Embrittlement Issues in three-dimensional integrated circuit Interconnections,” Materials Letters, 110, p.13-15, 2013.

    C. K. Chung, Y.J. Chen, T. L. Yang, and C. R. Kao, “Reactions of Sn-4.0Ag-0.5Cu on Cu and electroless Ni substrate in premelting soldering process,” Journal of Electronic Materials, 42, p.1254-1259, 2013.

    T. C. Huang, T. L. Yang, J. H. Ke, C. C. Li, and C. R. Kao, “Precipitation Induced by Diffusivity Anisotropy in Sn Grains under Electron Current Stressing,” Journal of Alloys and Compounds, 555, p.237-240, 2013.

    C. H. Lin, H.Y. Chuang, and C. R. Kao, “Cu(TiWN_x) Film as a Barrierless Buffer Layer for Metallization Applications ,” Japanese Journal of Applied Physics, 52, 01AC12, 2013.

    Y. J. Chen, C. K. Chung, C. R. Yang, and C. R. Kao, “Single-joint Shear Strength of Micro Cu pillar Solder bumps with Different Amounts of Intermetallics,” Microelectronics Reliability, 53, p.47-52, 2013

    C. R. Kao, A. T. Wu, K. N. Tu, and Y. S. Lai, “Reliability of Mirco-Interconnects in 3D IC Packages,” Microelectronics Reliability, 53, p. 1, 2013.

2012

    C. K. Chung, Y.J. Chen, W. M. Chen, and C. R. Kao, "Origin and Evolution of Voids in Electroless Ni during Soldering Reaction," Acta Materialia, 60, p.4586-4593, 2012.

    J. H. Ke, H. Y. Chuang, W. L. Shih, and C. R. Kao, "Mechanism for Serrated Cathode Dissolution in Cu/Sn/Cu Interconnect under Electron Current Stressing," Acta Materialia, 60, p.2082-2090, 2012.

    H. Y. Chuang, J. J. Yu, M. S. Kuo, H. M. Tong, and C. R. Kao, “Elimination of Voids in Reactions between Ni and Sn: a Novel Effect of Silver,” Scripta Materialia, 66, p.171-174, 2012.

    H. Y. Chuang, T. L. Yang, M. S. Kuo, Y.J. Chen, J. J. Yu, C.C. Li, and C. R. Kao, “Critical Concerns in Soldering Reactions Arising from Space Confinement in 3-D IC Packages,” IEEE Transactions on Device and Materials Reliability, 12, p.233-240, 2012.

    C. K. Chung, Y.J. Chen, C.C. Li, and C. R. Kao, “The Critical Oxide Thickness for Pb-Free Reflow Soldering on Cu Substrate,” Thin Solid Films, 520, p.5346-5352, 2012.

    C. K. Chung, T. C. Huang, R. Shia, T. L. Yang, and C. R. Kao*, “Roles of Phosphorous in Sn₄Ag_0.5Cu solder reaction with electrolytic Ni-Au,” Journal of Alloys and Compounds, 539, p.57-62, 2012.

    W. M. Chen, S. K. Kang and C. R. Kao, "Effects of Ti Addition to Sn-Ag and Sn-Cu Solders," Journal of Alloys and Compounds, 520, p.244-349, 2012.

2011

    J. H. Ke, T. L. Yang, Y. S. Lai, and C. R. Kao, "Analysis and Experimental Verification of the Competing Degradation Mechanisms for Solder Joints under Electron Current Stressing," Acta Materialia, 59, p.2462-2368, 2011.

    W. M. Chen, T. L. Yang, C. K. Chung, and C.R. Kao, “The Orientation Relationship between Ni and Cu₆Sn₅ Formed during the soldering reaction,” Scripta Materialia, 65, p.331-334, 2011.

    C. C Chang, Y. J. Chen, M. Y. Tsai, and C. R. Kao, "Laminar Pattern Induced by Cycling Thermomechanical Stress in Two-Phase Materials," Materials Chemistry and Physics,130, p.413-417, 2011.

    C. C. Chang, S. C. Yang, Y. J. Chen, and C. R. Kao, "Consumption of Cu Pad during Multiple Reflows of Ni-doped SnAgCu Solder," International Journal of Materials Research,102, p.579-583, 2011.

    M. Y. Tsai, Y. L. Lin, M. H. Tsai, Y. J. Chen, and C. R. Kao, "Experimental Evidence for Formation of Ni-AlCompound in Flip-Chip Joints under Current Stressing," Journal of Electronic Materials, 40, p.2076-2080, 2011.

    C. S. Liu, C. E. Ho, C. S. Peng, and C. R. Kao, “Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Solder Joints,” Journal of Electronic Materials, 40, p.1912-1920, 2011.

    J. Chen, Y. S. Lai, Y. W. Wang, and C. R. Kao, "Investigation of Growth Behavior of Al-Cu Intermetallic Compounds in Cu Wire Bonding," Microelectronics Reliability, 51, p.125-129, 2011.

2010

    C. K. Chung, J. G. Duh, and C. R. Kao, "Direct Evidence for Cu-Enriched Region at Boundary between Cu₆Sn₅ and Cu₃Sn during Cu/Sn Reaction," Scripta Materialia, 63, p.258-260, 2010.

    W. M. Chen, S. C. Yang, M. H. Tsai, and C. R. Kao, "Uncovering the driving force for massive spalling in Sn-Cu/Ni system," Scripta Materialia, 63, p.47-49, 2010.

    Y. W. Lin, J. H. Ke, H. Y. Chuang, Y. S. Lai,and C. R. Kao, "Electromigration in Flip Chip Solder Joints under Extra High Current Density," Journal of Applied Physics, 107, 073516, 2010.

    M. H. Tsai, W. M. Chen, M. Y. Tsai, and C. R. Kao, "Sn concentration effect on the formation of intermetallic compounds in high-Pb/Ni reactions" Journal of Alloys and Compounds, 504, p.341-344, 2010.

    H. Y. Chuang, C. H. Lin, J. P. Chu, and C. R. Kao, "Novel Cu-RuN_x Composite Layer with Good Solderability and Very Low Consumption Rate," Journal of Alloys and Compounds, 504, p.L25, 2010.

    S. C. Yang, C. C. Chang, M. H. Tsai, and C. R. Kao, "Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni," Journal of Alloys and Compounds, 499, p.149-153, 2010.

    M. Y. Tsai, S. C. Yang, Y. W. Wang, and C. R. Kao, "Grain growth sequence of Cu₃Sn in the Cu/Sn and Cu/Sn-Zn systems", Journal of Alloys and Compounds, 494, p.123-127, 2010.

    Y. W. Wang, Y. W. Lin, and C. R. Kao, "Inhibiting the Formation of Microvoids in Cu₃Sn by Additions of Cu to Solders," Journal of Alloys and Compounds, 493, p.233-239, 2010.

    C. C. Chang, Y. W. Lin, Y. W. Wang, and C. R. Kao, "The Effects of Solder Volume and Cu Concentration on the Consumption Rate of Cu Pad during Reflow Soldering," Journal of Alloys and Compounds, 492, p.99-104, 2010.

    C. C. Chang, Y. W. Wang, Y. S. Lai, and C. R. Kao, "Interfacial reaction between 95Pb-5Sn solder bump and 37Pb-63Sn presolder in flip-chip solder joints," Journal of Electronic Materials, 39, p.1289-1294, 2010.

    M. Y. Tsai, Y. L. Lin, Y. W Lin, J. H. Ke, and C. R. Kao, "Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed under High Current Density in Flip Chip Solder Joints," Journal of Electronic Materials, 39, p.2528-2535, 2010.

    Y. W. Wang, C. C. Chang, W. M. Chen, and C. R. Kao, "Effects of Ni additions on the growth of Cu₃Sn in high-lead solders," Journal of Electronic Materials, 39, p.2636-2642, 2010.

    C. C. Chang, H. Y. Chuang,Y. S. Lai, and C. R. Kao, "Interaction between Ni and Cu across 95Pb-5Sn High-Lead Layer," Journal of Electronic Materials, 39, p.2662-2668, 2010.

    H. Y. Chuang, C. H. Lin, J. P. Chu, C. R. Kao, “Novel Cu-RuN_x Composite Layer with Good Solderability and Very Low Consumption Rate,” ASE Technology Journal, 3, Issue 2, p.133, 2010.

    Y. W. Lin, J. H. Ke, T. L. Yang, C. R. Kao, "Study of Flip Chip Electromigration with Temperature Control," ASE Technology Journal, 3, Issue 1, p.57, 2010.

2009

    M. H. Tsai, Y. W. Lin,and C. R. Kao, "Effect of Sn Concentration on Massive Spalling in High-Pb Soldering Reaction with Cu Substrate," Journal of Materials Research, 24, p.3407, 2009.

    C. C. Chang, Y. W. Lin,Y. S. Lai, and C. R. Kao, "Fundamental Study of the Intermixing of 95Pb-5Sn High Lead Solder Bumps and the 37Pb-63Sn Pre-solder on Chip-Carrier Substrates," Journal of Electronic Materials, 38, p.2234, 2009.

    Yi-Shao Lai, C. R. Kao, Hsiao-Chuan Chang, Chin-Li Kao, "Effect of Multiple Reflow Cycles on Ball Impact Responses of Sn-Ag-Cu Solder Joints," Soldering and Surface Mount Technology, 21, p.4, 2009.

    Y. W. Wang, Y. W. Lin, C. T. Tu, and C. R. Kao, "Effects of Minor Fe, Co, and Ni Additions on the Reaction between SnAgCu Solder and Cu," Journal of Alloys and Compounds, 478, p.121, 2009.

    Y. W. Wang, C. C. Chang, and C. R. Kao, "Minimum Effective Ni Addition to SnAgCu Solders for Retarding Cu₃Sn Growth," Journal of Alloys and Compounds, 478, p.L1, 2009.

    M. Y. Tsai, M. H. Chou, and C. R. Kao, “Interfacial Reaction and the Dominant Diffusing Species in Mg-Ni System,” Journal of Alloys and Compounds, 471, p.90, 2009.

    ISI Highly Cited Papers, 2012.5-2012.11. Y. W. Wang, Y. W. Lin, and C. R. Kao, "Kirkendall Voids Formation in the Reaction between Ni-doped SnAg Lead-Free Solder and Different Cu Substrates," Microelectronics Reliability, 49, p.248, 2009.

    S. C. Yang, W. C. Chang, Y. W. Wang, and C. R. Kao, “Interfacial Reaction and wetting behavior between Pt and Molten Solder,” Journal of Electronic Materials, 38, p.25, 2009.

2008

    S. C. Yang, Y. W. Wang, C. C. Chang and C. R. Kao, “Analysis and experimental verification of the volume effect in the reaction between Zn-doped solders and Cu,” Journal of Electronic Materials, 37, p.1591, 2008.

    J. R. Huang, C. M. Tsai, Y. W. Lin, and C. R. Kao, “Pronounced electromigration of Cu in molten Sn-based solders,” Journal of Materials Research, 23, p.250, 2008.

    Y. L. Lin, Yi-Shao Lai, Y. W. Lin, and C. R. Kao, “Effect of UBM thickness on the mean-time-to-failure of flip chip solder joints under electromigration,” Journal of Electronic Materials, 37, p.96, 2008.

    Y. W. Lin, Yi-Shao Lai, Y. L. Lin, C. T. Tu, and C. R. Kao, “Tin whisker growth induced by high electron current density,” Journal of Electronic Materials, 37, p.17,2008.

    C. R. Kao, “Lead-free and lead-bearing electronic solders: implementation, reliability, and new technology,” JOM, 60, June, p.60, 2008.

2007

    C. W. Chang, S. C. Yang, Chun-Te Tu, and C. R. Kao, “Cross-interaction between Ni and Cu across Sn layers with different thickness,” Journal of Electronic Materials, 36, p.1455, 2007.

    S. C. Yang, C. E. Ho, C. W. Chang, and C. R. Kao, “Massive Spalling of Intermetallic in Solder-Substrate Reactions due to limited Supply of the Active Element,” Journal of Applied Physics, 101, 084911, 2007.

    Invited Review Article and ISI Highly Cited Papers, 2008.5-present. C. E. Ho, S. C. Yang, and C. R. Kao, “Interfacial reaction issues for lead-free electronic solders,” Journal of Materials Science – Materials in Electronics, 18, p.155, 2007.

2006

    Y. L. Lin, Yi-Shao Lai, C. M. Tsai, and C. R. Kao, “Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration,” Journal of Electronic Materials, 35, p.2147, 2006.

    S. C. Yang, C. E. Ho, C. W. Chang,and C. R. Kao, “Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu,” Journal of Materials Research,21, p.2436, 2006.

    C. W. Chang, C. E. Ho, S. C. Yang, and C. R. Kao, “Kinetics of AuSn₄ migration in lead-free solders,” Journal of Electronic Materials, 35, p.1948, 2006.

    C. M. Tsai, Yi-Shao Lai, Y, L. Lin, C. W. Chang, and C. R. Kao “In-Situ observation of material migration in flip-chip solder joints under current stressing,” Journal of Electronic Materials, 35, p.1781, 2006.

    C. M. Tsai, Y. L. Lin, J. Y. Tsai, Y. S. Lai, and C. R. Kao, “Local melting induced by electromigration in flip-chip solder joints,” Journal of Electronic Materials, 35, p.1005, 2006.

    C. E. Ho, Y. W. Lin, S. C. Yang, C. R. Kao, and D. S. Jiang, “The effect of limited Cu supply on the soldering reactions between SnAgCu and Ni,” Journal of Electronic Materials, 35, p.1017, 2006.

    Y. L. Lin, C. W. Chang, C. M. Tsai, C. W. Lee, and C. R. Kao, “Electromigration-induced UBM consumption and the resulting failure mechanisms in flip chip solder joints,” Journal of Electronic Materials, 35, p.1010, 2006.

    C. W. Chang, Q. P. Lee, C. E. Ho, and C. R. Kao, “Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples,” Journal of Electronic Materials, 35, p.366, 2006.

    J. Y. Tsai, C. W. Chang, C. E. Ho, Y. L. Lin, and C. R. Kao, “Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates,” Journal of Electronic Materials, 35, p.65, 2006.

    C. W. Chang, J. R. Huang, and C. R. Kao, “The effect of applied electron current on the Cu diffusion in molten Sn_3.5Ag,” Journal of Materials Science and Engineering, 38, No. 4, p.206, 2006.

2005

    A. T. Wu, A. M. Gusak, K. N. Tu, and C. R. Kao, “Electromigration-induced grain rotation in anisotropic conducting beta-tin,” Applied Physics Letters, 86, 241902, 2005.

    Y. H. Lin, Y. C. Hu, C. M. Tsai, C. R. Kao, and K. N. Tu, “In-situ observation of the void formation-and propagation mechanism in solder joints under current-stressing,” Acta Materialia, 53, p.2029, 2005.

    W. C. Luo, C. E. Ho, J. Y. Tsai, Y. L. Lin, and C. R. Kao, “Solid-state reactions between Ni and tin-silver-copper solders with different Cu concentrations,” Materials Science and Engineering A, 396, p.385, 2005.

    J. Y. Tsai, C. W. Chang, Y. C. Shieh, Y. C. Hu, and C. R. Kao, “Controlling the microstructure from the gold-tin Reaction,” Journal of Electronic Materials, 34, p.182, 2005.

    Y. H. Lin, C. M. Tsai, Y. C. Hu, Y. L. Lin, and C. R. Kao, “Electromigration induced failure in flip chip solder joints,” Journal of Electronic Materials,34, p.27, 2005.

    Y. H. Lin, C. M. Tsai, Y. C. Hu, Y. L. Lin, J. Y. Tsai, and C. R. Kao, “Electromigration induced metal dissolution in flip-chip solder joints,” Materials Science Forum, 2655, p. 475-479, 2005.

    S. C. Yang, C. E. Ho, and C. R. Kao, “The effect of volume on the soldering reaction between SnAgCu solders and Ni,” Journal of Materials Science and Engineering, 37, No. 4, p.230, 2005.

2004

    A. T. Wu, K. N. Tu, J. R. Lloyd, N. Tamura, B. C. Valek, and C. R. Kao, “Electromigration induced microstructure evolution in tin studied by synchrotron X-ray microdiffraction,” Applied Physics Letters, 85, p.2490, 2004.

    C. M. Tsai, W. C. Luo, C. W. Chang, Y. C. Shieh, and C. R. Kao, “Cross-interaction of UBM and soldering pad in flip-chip solder joints,” Journal of Electronic Materials, 33, p.1424, 2004.

    Y. L. Lin, W. C. Luo, Y. H. Lin, C. E. Ho, and C. R. Kao, “Effect of the gold thickness of the surface finish on the interfacial reactions in flip chip solder joints,” Journal of Electronic Materials, 33, p.1092, 2004.

    A. T. Wu, K. N. Tu, J. R. Lloyd, N. Tamura, B. C. Valek, and C. R. Kao, “The study of microstructure evolution of tin grains due to electromigration by using synchrotron X-ray microdiffraction,” TMS Letters, 1, p.165, 2004.

2003

    Y. C. Hu, Y. H. Lin, C. R. Kao, and, K. N. Tu, “Electromigration failure in flip chip solder joints due to rapid dissolution of copper,” Journal of Materials Research, 18, p.2544, 2003.

    J. Y. Tsai, Y. C. Hu, C. M. Tsai, and C. R. Kao, “A Study on the Reaction between Cu and Sn-3.5Ag Solder Doped with Small Amounts of Ni,” Journal of Electronic Materials, 32, p.1203, 2003.

    C. E. Ho, Y. L. Lin, J. Y. Tsai, and C. R. Kao, “Chemical reaction in advanced microelectronic packages,“ Journal of the Chinese Institute of Chemical Engineers, 34, p.387, 2003.

    C. R. Kao, “Recent progress in phase diagram calculation and application,” JOM, 55, December, p.47, 2003.

2002

    C. E. Ho, Y. L. Lin, and C. R. Kao, “Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni,“ Chemistry of Materials, 14, p.949, 2002.

    ISI Highly Cited Papers, 2005-2013. W. T. Chen, C. E. Ho, and C. R. Kao, “Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders,” Journal of Materials Research, 17, p.263, 2002.

    C. E. Ho, L. C. Shiau, and C. R. Kao, “Inhibiting the formation of (Au₁-xNi_x)Sn₄ and reducing the consumption of Ni metallization in solder joints,” Journal of Electronic Materials, 31, p.1264, 2002.

    ISI Highly Cited Papers, 2005-2013. C. E. Ho, R. Y. Tsai, Y. L. Lin, and C. R. Kao, “Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni,” Journal of Electronic Materials, 31, p.584, 2002.

    W. T. Chen, R. Y. Tsai, Y. L. Lin, and C. R. Kao, “Effect of copper concentration on the solid-state reactions between tin-copper lead-free solders and nickel,” Journal of Surface Mount Technology, 15, Issue 4, p.40, 2002.

    ISI Highly Cited Papers, 2006.7-2009.9. L. C. Shiau, C. E. Ho, and C. R. Kao, “Reactions between SnAgCu lead-free solders and the Au/Ni surface finish in advanced electronic packages,” Soldering and Surface Mount Technology, 14, p.25, 2002.