C. Robert Kao

  • Title: Distinguished Professor
  • Telephone: 886-2-3366-3745
  • E-Mail: This email address is being protected from spambots. You need JavaScript enabled to view it.
  • Office: Room 328, Heritage Hall of Physics
  • Lab: Advanced Chip Packaging Lab (Room 302, Heritage Hall of Physics)
  • Education:

    Ph. D., University of Wisconsin at Madison, Dec. 1994

  • Research Summary:

    My main research interests include electronic, optical, and MEMS packaging with a main thrust on the thermodynamics and kinetics of materials interactions within packages. My research group has authored over 120 technical papers, five of which are or had been classified as Highly Cited Papers by Essential Science Indicators. I am currently a Principal Editor for Journal of Materials Research and Associate Editor for Materials Chemistry and Physics.

  • Research Topics:

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  • Awards:

    Functional Materials Division Distinguished Scientist Award, The Minerals, Metals & Materials Society (TMS), San Diego, 2020
    Best Interactive Presentation Paper Award, IEEE Electronic Components and Technology Conference, 2019
    Outstanding Research Award, Ministry of Science and Technology, Taiwan, 2015
    Academician, Asia-Pacific Academic of Materials, 2015
    BRIMACOMBE MEDALIST AWARD, The Minerals, Metals & Materials Society, 2014
    Best Paper Award, 13th Electronic Circuits World Convention, Nuremberg, Germany
    Distinguished Professor, National Taiwan University, 2014-
    PCB Best Paper Award, Gold Prize, 2014

  • Selected Publication: