DSC DTA DMA Thermal Analyses (TA Q200 Q600 Q800)

DSC DTA DMA Thermal Analyses (TA Q200 Q600 Q800)

Technican:

Mr. Kuen-Jou Hsieh

Telephone:

886-2-3366-1346

Location:

Room 336, College of Engineering

Features:

Analyze the relationship between mechanical and thermal properties of materials, such as storage modulus, complex/dynamic viscosity, loss modulus, creep, compliance, stress/strain, storage/loss compliance, frequency, relaxation modulus, Tan δ, temperature, static/dynamic force.