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12/22 Seminar Speech

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建立於 2014-12-16, 週二 16:38
最近更新於 2014-12-17, 週三 10:09
發佈於：2014-12-16, 週二 16:38
點擊數：4523

Speaker: Prof. C. Robert Kao
Topic: Interfacial Reactions Arising from Low Solder Volume in 3D IC Packaging

Kao photo

Speaker: Prof. C. Robert Kao

Organization: Department of Materials Science and Engineering, National Taiwan University

Topic: Interfacial Reactions Arising from Low Solder Volume in 3D IC Packaging

Date: 10:20 AM ~ 12:10 PM, 2014.12.22

Location: Room 203, College of Engineering

附件:
Download this file (ICEPT C R KAO.docx)ICEPT C R KAO.docx117 kB