[Intel 英特爾] 學生實習職缺推廣 (One-year internship- JR0241552 Packaging Engineer Intern)

• 
• 

會員評等：  / 0

詳細內容

上層分類：系所公告

分類：徵才

建立於 2023-04-13, 週四 18:09

最近更新於 2023-04-13, 週四 18:36

發佈於：2023-04-13, 週四 18:11

點擊數：1822

各位同學好，我是任職於Intel招募團隊的HR Wendy。

目前Intel新竹辦公室正在招募1年期的實習生 (7/3/2023 – 7/2/2024)，有興趣的同學歡迎至以下連結投遞履歷，感謝您!

One-year internship- JR0241552 Packaging Engineer Intern

Apply link: https://intel.wd1.myworkdayjobs.com/External/job/Taiwan-Hsinchu/Packaging-Engineer-Intern_JR0241552

• Estimate internship plan:Work Location: Intel Hsinchu site
  • 1 year, July 3^rd 2023 – July 2^nd 2024
  • Full-Time 40 working hours weekly in July and Aug 2023 (2 months) and 24 hours per week (part-time) in Sep 2023 – July 2^nd 2024 for the remainder of 10 months.
• Job Description:
  • Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
  • Responsible for early engagement with NPI development to ensure robust package quality, reliability and manufacturability.
  • Flawless execution on product ramp and HVM sustaining activities including yield improvement, change control, excursion management and value engineering projects .
• Qualifications:
  • Good in English verbal and written communications.
  • Good in MS Office knowledge, Excel, Power Point.
  • Good analytical and data management skills.
  • Familiar with various packaging process and technology for Wire Bond and Flip Chip.

有任何問題，請歡迎與我聯繫：

• Intel Talent Advisor- Wendy Chen

• Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它