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12/12(一)專題演講公告

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演講人:鄒覺倫 先生

演講題目:Advanced Packaging Technology Outlook

演講時間:111年12月12日(星期一)早上10點20分

演講地點:工綜203國際演講廳

服務單位:台灣積體電路製造股份有限公司/處長

個人學歷:

 

畢業學校

國別

主修學門系所

學位

University of California, Berkeley

美國

Materials Science and Engineering

碩士

國立成功大學

中華民國

冶金及材料工程學系

學士

 

個人經歷:

 

服務機關

服務部門

職稱

現職:

TSMS

先進封裝業務開發

處長

經歷:

創意電子

產品營運處

副總

TSMC North America

Assembly and Test Services

副處長

Cirrus Logic

Wordwide Operations

Packaging Eng./Ops.Mger.

Apple Computer

Manufacturing R&D

Staff

 

演講摘要:

The semiconductor industry is encountering more technical and economin challenges with Moores Law, the industry has started to resort to advanced packaging technologies to continue the needed scaling and chip integration for the next-generation electronics products for advanced application.
TSMC has been focusing on developing and delivering the advanced Si technologies as total system solutions for customers, demanding products.
The presentation will focus on advanced packaging technology trend and an overview of TSMCS 3DFabric TM technologies.

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