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12/24 Seminar Speech

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建立於 2018-12-19, 週三 14:03
最近更新於 2018-12-24, 週一 13:07
發佈於：2018-12-19, 週三 14:05
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Speaker: Professor Fan-Yi Ouyang

Topic: Reliability Challenging of Pb-Free Microbumps in 3D Packaging Technology

20181224-Fan-Yi Ouyang

Speaker：Professor Fan-Yi Ouyang

Organization：Department of Engineering and System Science, National Tsing Hua University

Topic：Reliability Challenging of Pb-Free Microbumps in 3D Packaging Technology

Date：10:20 , 2018.12.24

Location：Room 203, College of Engineering

Education：

The University of California, Los Angeles (UCLA) / Department of Material Science and Engineering / Ph.D.

National Tsing Hua University / Department of Engineering and System Science / MS

National Tsing Hua University / Department of Engineering and System Science / BS

Work Experience：

National Tsing Hua University / Department of Engineering and System Science / Associate Professor

National Tsing Hua University / Department of Engineering and System Science / Assistant Professor

Intel Corporation, Oregon, USA / Portland technology development center / Quality and reliability engineer

Abstract：

As power delivery and bandwidth demands continue to scale with Si and system scaling, packaging technology development that enables this scaling will be critical. Packaging technology is transitioning toward the three-dimensional integrated circuit (3D IC) and a larger temperature gradient is expected to be established when dissipating the heat from the surface. Hence, understanding how the temperature gradient affects diffusion behavior of 3D IC microbumps is important. In addition, when the size of the microbumps shrinks into few micrometers, the effect of electromigration and grain size cannot be ignored. In this talk, the reliability challenging- failure induced by electromigration and thermomigration of Pb-free microbump in 3D IC would be discussed. The effect of grain orientation of microbump and the reliability issue induced by fast intermetallic compound formation would be included.

20181224