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9/26 Seminar Speech

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Speaker:林凱南 博士

Topic:Introduction of Semiconductor Wafer Manufacturing

 

Speaker:Dr. Kai-Nan Lin

Organization:project manager of  Taisil Electronic Materials Corp.

Topic:Introduction of Semiconductor Wafer Manufacturing

Date: 10:10 , 2016.09.26

Location:Room 203,College of Engineering

 

Abstract:

As the leading edge IC manufacturing developing, wafer substrate plays more and more important role as being not only the simple sustaining media but also the key raw material for metal contamination gettering, device reliability improvement and lithography overlay performance enhancement......etc.
In the presentation, we will first go through the processes of 200mm and 300mm wafer manufacturing as following steps:

1. Crystal growth

2. Wafering

(1) Wire saw cutting
(2) Edge profiling
(3) Grinding
(4) Etching
(5) Edge polishing
(6) Surface polishing

3. Epi

Also, the presentation will cover the IC application of different wafer types and some successful stories of the yield or inline parameter improvement by suitable wafer selection or wafer parameters (shape, flatness, defect...etc).
Finally, the new wafer substrate type "SOI" (silicon on insulator) would also be introduced in the presentation. Recently, there are lots of RF (radio frequency) applications established on SOI product family platform with IoT (Internet of Things) and automotive usages.