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| 姓名 | 高振宏 |
|---|---|
| 學歷 | 美國威斯康辛大學麥迪遜校區博士1990.6 - 1994.12 美國西北大學1988.9 - 1990.6 國立臺灣大學1982.9 - 1986.6 |
| 主要經歷 | IEEE Trans on Electronic Packaging Manufacturing Guest Editor 2006-present 中央大學材料所所長 2005/8-2006/7 中央大學化材系教授 1999/8-2006/7 Journal of Materials Research Principle Editor 2003/5-present The Electronic, Magnetic & Photonic Materials division Councilor 2002/2-2005/4 Univ of California –LA Dept of Mater.Sci. & Eng. Visiting Prof. 2002/7-2003/1 Journal of Electronic Materials Guest Editor Jan Issue, 2006 Journal of Electronic Materials Guest Editor Oct Issue, 2004 Journal of Electronic Materials Guest Editor Dec Issue, 2003 Journal of Electronic Materials Guest Editor Nov Issue, 2003 Journal of Electronic Materials Guest Editor Nov Issue, 2002 Journal of Electronic Materials Guest Editor Sep Issue, 2001 TMS JOM期刊 Advisor 2001/2-2004/2 中央大學化工系副教授 1996/8-1999/2 中央大學化工系助理教授 1995/8-1996/7 Univ of Wisconsin-Madison Dept of MSE Research Associate 1994/12-1995/8 |
| 聯絡電話 | 02-33663745 |
| 專長 | 1.Microelectronic & Nanoelectronic Packaging 2.Optoelectronic Packaging 3.MEMS Packaging 4.Solids State Thermodynamics, Diffusion Theory and Solid Reaction |
| 授課課程 | 相平衡與相圖、材料熱力學 |
| 實驗室 | 晶芯封裝實驗室(二號館302) |
| 個人實驗室網址 | http://www.mse.ntu.edu.tw/~mml |
| 榮譽 | 1、依 ISI Essential Science Indicators 2006.7.1 版統計， Journal of Materials Research , 17 , p.263, 2002 、 Journal of Electronic Materials , 31 , p.584, 2002 、 Soldering and Surface Mount Technology , 14 , p.25, 2002 , 等三篇文章 已被 ISI 列為 " Highly Cited Papers " ，亦即該 三 文被引用次數排名其領域前 1% 。同時期台灣所有科學及工程領域中僅有 494 篇文章屬 Highly Cited Papers ，在材料領域則僅有 52 篇 2、獲 ISI Essential Science Indicators 2006 年版收錄於 Materials Science 領域，亦即於材料領域之總 citation number 排名所有研究學者之前 1 % 3、受邀擔任 Discussion Leader , Gordon Research Conference on High Temperature Materials , Colby College, Maine, July 16-21, 2006 4、中央大學 93 學年度 學術研究傑出獎 。 5、Best International Paper Award , The 2002 SMTA International Technical Conference, Chicago , IL , September 22-26, 2002 6、中央大學工學院 2001 年 研究優良教師 7、Invited speaker on the opening day of the Gordon Research Conference on High Temperature Materials, Processes, and Diagnostics , Plymouth State College, NH, U.S.A., 2000 8、Young Leader , The Minerals, Metals & Materials Society, 1999 9、中央大學工學院1988年教學優良教師 10、Graduate Student Award Materils Researc Society 1992 |
| 組別 | 金屬組 |
|---|
個人著作
- 期刊論文
- C. W. Chang, S. C. Yang, C. T. Tu, and C. R. Kao, “Cross-interaction between Ni and Cu across Sn layers with different thickness,” Journal of Electronic Materials, 36, 1455, (2007)
- C. E. Ho, S. C. Yang, and C. R. Kao,” Interfacial reaction issues for lead-free electronic solders,” Journal of Materials Science-Materials in Electronics, 18, 155-174 (2007)
- S. C. Yang, C. E. Ho, C. W. Chang, and C. R. Kao,” Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element.” Journal Applied Physics, 101, 084911 (2007)
- C. E. Ho, S. C. Yang, and C. R. Kao, "Interfacial reaction issues for lead-free electronic solders,"Journal of Materials Science – Materials in Electronics, 18, 155 (2007)
- Y. L. Lin, Y. S. Lai, C. M. Tsai, and C. R. Kao, "Effect of surface finish on the failure mechanisms of flip chip solder joints under electromigration" Journal of Electronic Materials, 35, 2147 (2006)
- J. Y. Tsai, C. W. Chang, C. E. Ho, Y. L. Lin, and C. R. Kao, "Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates," Journal of Electronic Materials, 35, 65 (2006)
- C. W. Chang, Q. P. Lee, C. E. Ho, and C. R. Kao, "Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples," Journal of Electronic Materials, 35, 366 (2006)
- Y. L. Lin, C. W. Chang, C. M. Tsai, C. W. Lee, and C. R. Kao, "Electromigration-induced UBM consumption and the resulting failure mechanisms in flip chip solder joints," Journal of Electronic Materials, 35, 1010 (2006)
- C. E. Ho, Y. W. Lin, S. C. Yang, C. R. Kao, and D. S. Jiang, "The effect of limited Cu supply on the soldering reactions between SnAgCu and Ni, "Journal of Electronic Materials, 35, 1017 (2006)
- C. M. Tsai, Y. L. Lin, J. Y. Tsai, Y. S. Lai, and C. R. Kao, "Local melting induced by electromigration in flip-chip solder joints," Journal of Electronic Materials, 35, 1005 (2006)
- C. M. Tsai, Yi-Shao Lai, Y, L. Lin, C. W. Chang, and C. R. Kao,"In-Situ observation of material migration in flip-chip solder joints under current stressing," Journal of Electronic Materials, 35, 1781 (2006)
- C. W. Chang, C. E. Ho, S. C. Yang, and C. R. Kao,"Kinetics of AuSn4 migration in lead-free solders," Journal of Electronic Materials, 35, 1948 (2006)
- S. C. Yang, C. E. Ho, C. W. Chang,and C. R. Kao, "Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu," Journal of Materials Research, 21, 2436 (2006)
- Y. H. Lin, C. M. Tsai, Y. C. Hu, Y. L. Lin, J. Y. Tsai, and C. R. Kao, "Electromigration induced metal dissolution in flip-chip solder joints," Materials Science Forum, 475-479, 2655 (2005)
- Y. H. Lin, C. M. Tsai, Y. C. Hu, Y. L. Lin, and C. R. Kao, "Electromigration induced failure in flip chip solder joints, " Journal of Electronic Materials, 34, 27 (2005)
- J. Y. Tsai, C. W. Chang, Y. C. Shieh, Y. C. Hu, and C. R. Kao, "Controlling the microstructure from the gold-tin Reaction," Journal of Electronic Materials, 34, 182 (2005)
- W. C. Luo, C. E. Ho, J. Y. Tsai, Y. L. Lin, and C. R. Kao, "Solid-state reactions between Ni and tin-silver-copper solders with different Cu concentrations," Materials Science and Engineering A, 396, 385 (2005)
- Y. H. Lin, Y. C. Hu, C. M. Tsai, C. R. Kao, and K. N. Tu, "In-situ observation of the void formation-and propagation mechanism in solder joints under current-stressing," Acta Materialia, 53, 2029 (2005)
- A. T. Wu, A. M. Gusak, K. N. Tu, and C. R. Kao, "Electromigration-induced grain rotation in anisotropic conducting beta-tin," Applied Physics Letters, 86, 241902 (2005)
- 研討會論文
- Y. W. Wang and C. R. Kao, "The effects of minor Fe, Co, and Ni addition to lead-free solders on the thickness of Cu3Sn at the interface," International Microsystems. Packaging, Assembly and Circuits Technology Conference, 280, IEEE (2007)
- S. C. Yang and C. R. Kao, "Role of minor Zn addition in the interfacial reaction between lead-free solder and Cu," International Microsystems, Packaging, Assembly and Circuits Technology Conference, 102, IEEE (2007)
- C. C. Chang and C. R. Kao, "Dissolution and interfacial reaction between Cu and SnAgCu solders," International Microsystems. Packaging, Assembly and Circuits Technology Conference, 54, IEEE (2007)
- S. C. Yang and C. R. Kao, “Massive Spalling of Intermetallic in Solder Joints: a General Phenomenon that can Occur in Multiple Solder-Substrate Systems,” Proceedings of 57th Electronic Components & Technology Conference, Reno, NV , 1825, IEEE(2007)
- S.C. Yang, C.E. Ho, C.W. Chang, and C. R Kao, "Effect of Zn Addition on the Interfacial Reactions between Cu and Lead-Free Solders," in Advanced Electronic Packaging, Materials Research Society Symposium Proceeding, 968, Warrendale, PA, 0968-V03-03 (2007)
- S. C. Yang, C. E. Ho, C. W. Chang, and C. R Kao, "Massive Spalling of Intermetallic Compound in Lead-Free Solder Joints," in Advanced Electronic Packaging, Materials Research Society Symposium Proceeding, 968, Warrendale, PA, 0968-V03-01. (2007)
- C. E. Ho, S. C. Yang, and C. R. Kao, “Interfacial reaction issues for lead-free electronic solders,” in Lead-Free Electronic Solders, Springer, New York, NY, 155 (2007)
- 王儀雯，高振宏，” 添加微量元素至無鉛銲料對介金屬生長之影響,”中國材料學會2007年會論文集, P03-081 (2007)
- S. C. Yang and C. R. Kao, "Massive Spalling of Intermetallic in Solder Joints: a General Phenomenon that Can Occur in Multiple Solder-Substrate Systems,”中國材料學會2007年會論文集, P03-035 (2007)
- 張智強，高振宏，”Cu體積效應與添加微量Ni對銲接時Cu墊層消耗速率及界面反應的影響,”中國材料學會2007年會論文集, P03-014 (2007)
- 林彥良，高振宏，"覆晶銲點中電遷移效應導致UBM消耗及其失效機制研究"，化學工程師年會，6，P-17 (2006)
- 鍾承翰，高振宏，"Cu6Sn5 中主要擴散元素與生成動力學的研究"，中國材料學會2006年會論文集，P03-087 (2006)
- 王儀雯，高振宏，"添加微量Fe、Co、Ni至無鉛銲料對界面生成物Cu3Sn厚度之影響"，中國材料學會2006年會論文集，P03-085 (2006).
- 陳欣楷，蔡家銘，賴逸少，高振宏，"以電腦模擬來探討電遷移現象之物理因素的敏感"，中國材料學會2006年會論文集，P03-086 (2006)
- 周明弘，高振宏，"儲氫材料Mg2Ni生長動力學之研究，"中國材料學會2006年會論文集，P01-008 (2006)
- 張建偉，黃建融，高振宏，"電遷移對銅原子在熔融Sn3.5Ag 無鉛銲料中擴散行為之影響"，中國材料學會2006年會論文集，P03-088 (2006)
- 張智強，高振宏，"Cu濃度對SnAgCu無鉛銲料與Cu銲接反應之影響，"中國材料學會2006年會論文集，P03-084 (2006)
- C. W. Chang, C. E. Ho, S. C. Yang, and C. R. Kao, "Kinetics of AuSn4 migration in lead-free solders," Proceedings of IMAPS Taiwan 2006 International Technical Symposium (2006)
- S. C. Yang, C. E. Ho, C. W. Chang, and C. R. Kao, "Influence of Zn Content on the Interfacial Reactions between Sn-Zn Solders and Cu Metallization," Proceedings of IMAPS Taiwan 2006 International Technical Symposium (2006)
- C. E. Ho and C. R. Kao, "Interfacial reaction between solder and surface finishes," Proceedings of COST Action 531 Lead-Free Solder Materials Mid-Term Meeting, Lausanne, Switzerland (2005)
- A. T. Wu, N. Tamura, J. R. Lloyd, C. R. Kao, and K. N. Tu, "Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigration," Materials Research Society Symposium Proceeding, 863, B9.10.1 (2005)
- C. E. Ho, Y. W. Lin, S. C. Yang, and C. R. Kao, "Volume Effect in the Soldering Reaction between SnAgCu Solders and Ni," Proceedings of International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, 39, IEEE (2005)
- 羅偉誠、高振宏，"SnAgCu系列無鉛銲料應用於先進微電子封裝之研究:Cu濃度影響之探討(3/3)"，2005年化工年會論文全集，OM-13 (2005)
- 林育蔚、何政恩、高振宏，"電遷移對Tin Whisker生長行為之影響"，中國材料學會2005年會論文集，2-1-P-006 (2005)
- 陳羿錦、高振宏，"無鉛銲料與Pt、Cu基材界面反應之研究"，中國材料學會2005年會論文集，2-1-P-005 (2005)
- 楊素純、何政恩、高振宏，"體積效應對SnAgCu無鉛銲料與Ni銲接反應的影響"，中國材料學會2005年會論文集，2-1-P-021, (2005)
- 張建偉、何政恩、高振宏，"探討純錫接點中AuSn4之遷移動力學"，中國材料學會2005年會論文集，2-1-P-038 (2005)
- C. M. Tsai and C. R. Kao, "Microstructural evolution induced local melting in flip-chip solder joint under current stressing," Proceedings of IMAPS Taiwan 2005 International Technical Symposium, 104 (2005)
- C. E. Ho, W. C. Luo, S. C. Yang, and C. R. Kao, "Copper concentration effect and solder volume effect on the soldering reaction between Sn-Ag-Cu lead-free solder and Ni," Proceedings of IMAPS Taiwan 2005 International Technical Symposium, 98 (2005)
- C. W. Chang and C. R. Kao, "Morphology of thermal aging result in Au/Sn/Cu diffusion couple," Proceedings of IMAPS Taiwan 2005 International Technical Symposium, 92 (2005)
- Y. L, Lin, Y. S. Lai, and C. R. Kao, "Effect of electromigration on UBM consumption in 63Sn37Pb flip chip solder joints," Proceedings of IMAPS Taiwan 2005 International Technical Symposium, 80 (2005)
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