[Intel 英特爾] 學生實習職缺推廣 (One-year internship- JR0241552 Packaging Engineer Intern)

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詳細內容: 上層分類：系所公告; 分類：徵才; 建立於 2023-04-13, 週四 18:09; 最近更新於 2023-04-13, 週四 18:36; 發佈於：2023-04-13, 週四 18:11; 點擊數：1093

各位同學好，我是任職於Intel招募團隊的HR Wendy。

目前Intel新竹辦公室正在招募1年期的實習生 (7/3/2023 – 7/2/2024)，有興趣的同學歡迎至以下連結投遞履歷，感謝您!

One-year internship- JR0241552 Packaging Engineer Intern

Estimate internship plan:Work Location: Intel Hsinchu site
- 1 year, July 3^rd 2023 – July 2^nd 2024
- Full-Time 40 working hours weekly in July and Aug 2023 (2 months) and 24 hours per week (part-time) in Sep 2023 – July 2^nd 2024 for the remainder of 10 months.
Job Description:
- Microelectronic Packaging Engineers provide project management, package development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.
- Responsible for early engagement with NPI development to ensure robust package quality, reliability and manufacturability.
- Flawless execution on product ramp and HVM sustaining activities including yield improvement, change control, excursion management and value engineering projects .
Qualifications:
- Good in English verbal and written communications.
- Good in MS Office knowledge, Excel, Power Point.
- Good analytical and data management skills.
- Familiar with various packaging process and technology for Wire Bond and Flip Chip.

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