12/24(一)專題演講公告
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- 詳細內容
- 上層分類：系所公告
- 分類：演講
- 建立於 2018-12-19, 週三 13:45
- 最近更新於 2018-12-24, 週一 13:07
- 發佈於：2018-12-19, 週三 13:48
- 點擊數：8053
演 講 者：歐陽汎怡 教授
演講題目：Reliability Challenging of Pb-Free Microbumps in 3D Packaging Technology
演講人：歐陽汎怡 教授
服務單位：國立清華大學工程與系統科學系暨研究所
演講題目：Reliability Challenging of Pb-Free Microbumps in 3D Packaging Technology
演講時間：107年12月24日(星期一)早上10點20分
演講地點：工綜館203國際演講廳
個人學歷：
美國加州大學洛杉磯分校 (UCLA) / 材料科學與工程學系 / 博士
國立清華大學 / 工程與系統科學系暨研究所 / 碩士
國立清華大學 / 工程與系統科學系暨研究所 / 學士
個人經歷：
國立清華大學 / 工程與系統科學系暨研究所 / 副教授 (現職)
國立清華大學 / 工程與系統科學系暨研究所 / 助理教授
Intel Corporation, Oregon, USA / Portland technology development center / Quality and reliability engineer
演講摘要：
As power delivery and bandwidth demands continue to scale with Si and system scaling, packaging technology development that enables this scaling will be critical. Packaging technology is transitioning toward the three-dimensional integrated circuit (3D IC) and a larger temperature gradient is expected to be established when dissipating the heat from the surface. Hence, understanding how the temperature gradient affects diffusion behavior of 3D IC microbumps is important. In addition, when the size of the microbumps shrinks into few micrometers, the effect of electromigration and grain size cannot be ignored. In this talk, the reliability challenging- failure induced by electromigration and thermomigration of Pb-free microbump in 3D IC would be discussed. The effect of grain orientation of microbump and the reliability issue induced by fast intermetallic compound formation would be included.
