9/26 專題演講公告

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詳細內容

上層分類：系所公告

分類：演講

建立於 2016-09-19, 週一 09:37

最近更新於 2016-09-20, 週二 11:54

發佈於：2016-09-19, 週一 09:41

點擊數：2372

演講人：林凱南 博士

演講題目：Introduction of Semiconductor Wafer Manufacturing

 

  

演講人：林凱南 博士

服務單位：中德電子材料專案經理

演講題目：Introduction of Semiconductor Wafer Manufacturing

演講時間：105年09月26日(星期一) 10點10分

演講地點：工綜館203(國際演講廳)

個人簡歷：

1. 學歷

國立台灣大學材料科學與工程學系暨研究所博士(D94)
國立台灣大學材料科學與工程學系暨研究所碩士(R92)
國立台灣大學機械工程學系學士(B88)

2. 經歷

美商SunEdisonSEMI R&D專案經理 (Aug'15 ~ now)
美商SunEdisonSEMI Field application技術經理 (Aug'14 ~ Aug'15)
TSMC 製程整合主任工程師 (Sep'09 ~ May'13)

 

內容摘要：

As the leading edge IC manufacturing developing, wafer substrate plays more and more important role as being not only the simple sustaining media but also the key raw material for metal contamination gettering, device reliability improvement and lithography overlay performance enhancement......etc.
In the presentation, we will first go through the processes of 200mm and 300mm wafer manufacturing as following steps:

1. Crystal growth

2. Wafering

(1) Wire saw cutting
(2) Edge profiling
(3) Grinding
(4) Etching
(5) Edge polishing
(6) Surface polishing

3. Epi

Also, the presentation will cover the IC application of different wafer types and some successful stories of the yield or inline parameter improvement by suitable wafer selection or wafer parameters (shape, flatness, defect...etc).
Finally, the new wafer substrate type "SOI" (silicon on insulator) would also be introduced in the presentation. Recently, there are lots of RF (radio frequency) applications established on SOI product family platform with IoT (Internet of Things) and automotive usages.